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US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Methods of forming packages and resulting structures" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,220, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Methods of forming packages and res... Read More


US Patent Issued to ALEDIA on Aug. 25 for "Optoelectronic device and method for manufacturing such a device" (French Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,221, issued on Aug. 25, was assigned to ALEDIA (Echirolles, France). "Optoelectronic device and method for manufacturing such a device" was... Read More


US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on Aug. 25 for "Semiconductor package structure, fabrication method and memory system" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,222, issued on Aug. 25, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Semiconductor package structure, fabrication ... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,223, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of fabricat... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package and system including semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,224, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and system including s... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,225, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and method of manuf... Read More


US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Aug. 25 for "Packaging module and electronic device" (Chinese, Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,226, issued on Aug. 25, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Packaging module and electronic device" was inven... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package including a plurality of semiconductor chips in a stacked structure" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,228, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including a plurality ... Read More


US Patent Issued to SK hynix on Aug. 25 for "Memory and semiconductor package with peripheral capacitors" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,229, issued on Aug. 25, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Memory and semiconductor package with peripheral capacit... Read More


US Patent Issued to Illumina on Aug. 25 for "Sensor system" (California Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,230, issued on Aug. 25, was assigned to Illumina Inc. (San Diego). "Sensor system" was invented by Tracy Helen Fung (San Mateo, Calif.) and... Read More